Au Bump
1. Background
As package miniaturization and space-reduction technologies enhance overall product performance in contemporary electronic devices, Flip-Chip Bonding (FCB) – characterized by a small mounting footprint and reduced wiring distance – applications are increasing.
2. Application
Flip-Chip Bonding involves the bonding of on-chip electrodes to printed circuit board (PCB) electrodes through Au bumps. Without incorporating additional wiring, the bond strength directly influences the circuit’s conductivity. Since bond alloying contributes to reinforced bond strength, measuring the area ratio of non-alloy Au electrodes enables inspectors to confirm the degree of bond between the bump and the circuit board.
3. The Olympus solution
The Olympus DSX1000 digital microscope achieves resolutions comparable to state-of-the-art optical microscopes through the incorporation of high-NA/low-aberration field lenses. Extended Focal Image (EFI) technology allows users to acquire clear imagery across the entire field, even for difficult-to-focus surface configurations. Acquired images are directly transmitted via OLYMPUS Stream software for measurement. Users may further refine the measurement area through HSV settings.
Brightfield Imagery: 50X field lens with 4X zoom |
Manual HSV threshold settings | ||
ROI designation / measurement result
