Electronics

Olympus Solutions for Electronics

Electronics are getting smaller, and so are their components. Inspecting microcircuits, semiconductor wafers, and other electronics is challenging because even a small piece of debris can cause a malfunction.

Manufacturers use microscopes with high-quality optics to inspect soldered connections in circuits, the condition of wires in printed circuit boards, and to look for contaminants. In some applications, the roughness of the components used in a device is measured using noncontact laser confocal microscopes to ensure they meet strict standards.

5G Device Measurement and Inspection Solutions

Microscope Solutions for Semiconductor Manufacturing

Microscope Solutions for PCB Manufacturing

Microscope Solutions for Lithium-Ion Battery Manufacturing

More Resources

Blog

Mix Observation Methods to See More in Your Wafer Defect Inspection

Static Electricity and Surface Roughness in Films: An Experiment

Advantages of Laser Microscopes for Measuring the Roughness of Copper Foil used in 5G PCBs

Controlling Quality Control in Electronics Manufacturing Using PRECiV™ Software

A Smart Way to Control Contamination for High-Throughput Metrology and Inspection

5 zalet mikroskopu cyfrowego DSX1000

Czym jest mikroskop cyfrowy?

ASNT 2018 Wrap Up

Od makro do mikro: jak mikroskopy cyfrowe zmieniają kontrole przemysłowe

Toy Trouble: Detecting Hazardous Materials in a Popular Toy

Uzyskiwanie obrazów o wysokiej jakości przez warstwę krzemową bez uszkadzania gotowego produktu

Automatyczne wykrywanie cząstek w tellurku kadmowo-cynkowym za pomocą oprogramowania do analizy obrazów

Consumer Product Testing Using Vanta Handheld XRF

Trend do przechodzenia na oświetlenie LED w zastosowaniach mikroskopowych

Pod mikroskopem stereoskopowym

Zalety w pełni zmotoryzowanego systemu mikroskopowego

Optymalne wykorzystanie oświetlenia Köhlera

Do czego można wykorzystać obrazową bazę danych?

Get the Most Out of Your Thickness Gauge with Instructional Videos

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Uwagi dotyczące aplikacji

プリント基板（PCB）における不良解析の課題と解析事例紹介

Using a High-Resolution Digital Microscope to Perform Highly Accurate Thickness Measurements of the Internal Layer of a Multilayer Ceramic Condenser

High-precision three-dimensional measurement : Measuring the shape of microchannels with a 3D laser microscope (Japanese only)

Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope

Inspecting Glass Fiber Peeling in a Printed Wiring Board’s Glass Epoxy Substrate—Clear Images Are Essential for Quality Control

Wykrywanie wad produkcyjnych na waflach półprzewodnikowych za pomocą mikroskopu cyfrowego

Akwizycja wyraźnych obrazów i dokładne wymiarowanie laminowanego kondensatora ceramicznego przy użyciu mikroskopu cyfrowego

Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope

How a Digital Microscope’s Deep Focal Depth Enables the Complete Inspection of Connector Pins

Inspecting Bonding Wires Using a Digital Microscope

Inspecting the Cavity Profile of Xenon Difluoride (XeF2) Etched Silicon (Si) Wafers for Suspended Antenna-Coupled Nanothermocouples

Measuring the Profile of a Bonding Wire Ball

Measuring the Thickness of Photoresist Film

Height Measurement of Microscopic Bumps on an Integrated Circuit

Measuring the shape of scratches on vehicle-mounted camera lenses

Measuring the shape of an automotive millimeter-wave radar’s circuit board

Measuring the Layer Profiles of Thin-Film Solid-State Lithium-Ion Batteries Manufactured Using the Inkjet Technique

Pomiar chropowatości powierzchni pola pod strukturę półprzewodnikową na ramce wyprowadzeniowej

Measuring the Roughness of Lithium-Ion Battery Electrodes Using a Laser Microscope

Pomiar chropowatości powierzchni kolektorów elektrod akumulatorów litowo-jonowych

Using a microscope to inspect the solder wettability of mounting components

Observing the Surface Condition of Separators in Lithium-Ion Batteries Using a Scanning Probe Microscope (SPM) Combined with a Laser Microscope

Surface Roughness Evaluation of Memory Cards

Kontrola matrycy układu scalonego na próbkach wafli

Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity

Wiring Inspections for Flexible Printed Circuit Boards (PCBs)

Pomiar odsetka powierzchni zajmowanej przez złoto (Au) wykonywany na powierzchniach lutowanych po oddzieleniu kulki

Zanieczyszczenia w otworach przelotowych płytek drukowanych

Pomiary wymiarów tłoczonej taśmy nośnej dla kondensatorów

Step measurement of transparent film applied to a glass surface

Evaluating the Coating on a Smartphone Housing / Film thickness measurement and 3D surface profile measurement using a laser microscope

Roughness Evaluation of the Inner Lead of a Lead Frame / Surface roughness measurement of a micro area using a laser microscope

Ocena profilu powierzchni płyt dyfuzyjnych w ekranach LCD / Bezstykowy pomiar trójwymiarowego kształtu z użyciem mikroskopu laserowego

Evaluating the Shape of the Landing Zone Pattern and Contaminants on a Hard Disk / All-in-one system of optical, laser, and probe microscope capabilities provides seamless measurement from the millimeter to nanometer level.

Profil powierzchni płytki rozpraszającej światło w ekranach LCD / Bezstykowy pomiar trójwymiarowego kształtu z użyciem mikroskopu laserowego

Quantitative Investigations of the Interconnect

Looking towards a Future of Affordable Solar Energy

Studying the Electro-mechanical Behavior of Thin Films

Pomiar chropowatości powierzchni podłoża płytki drukowanej przy użyciu laserowego mikroskopu konfokalnego Olympus OLS4100

Evaluating the Contacting Terminals of Wafer Level Chip Size Packages (CSPs) using the Olympus OLS4100 Laser Confocal Microscope

Zastosowanie laserowego mikroskopu konfokalnego Olympus OLS5000 do pomiaru chropowatości powierzchni płytek drukowanych

Sectioning Analysis for Ball Grid Array (BGA) Surface Mounting of Semiconductor Package using the Olympus OLS5000 Laser Confocal Microscope

Setting standards in optical metrology at the PTB

Inspection of PGA packaging

Analiza przekroju poprzecznego BGA

Semiconductor Bear Wafer Lasermark

Alternatywne materiały dla alternatywnych źródeł energii

Maximizing Data Recovery: Utilizing 3D Digital Laser Microscopy to Image Damaged Optical Media

The Benefits of Handheld XRF for Medical Device RoHS Compliance

The future of industrial quality control

Quilt Packaging: Lining Up an Array of Opportunities

HHXRF Analyzers for Screening Consumer Goods for Lead (Pb), Cadmium (Cd) and Other Metals

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Filmy

RVI Tutorial Video Series—Inspection Management with the IPLEX™ NX Videoscope

IE Japan Seminar: DSX1000 Solution

IE Japan Seminar: Microscope Solution

IE Japan Seminar: Stereo Microscope and Digital Camera Solution

DSX1000: Demonstration Guaranteed The Accuracy and Repeatability

DSX1000: Demonstration Stiching Function

DSX1000: Demonstration Reproduction Function of Observation Conditions

DSX1000: Demonstration Various Observation Method With One Touch

DSX1000: Demonstration Best Image Function

DSX1000: Demonstration Free Angle Observation System

DSX1000: Demonstration Wide Field Range Observation from Macro to Micro

DSX1000: Demonstration Digest

OLS5000: Demonstration (Japanese only)

Olympus Solutions for the Electronics Industry

DSX1000: wideo promocyjne

Vanta Technical Tutorial Series: Getting Started with Vanta PC Software

CIX100 - Technical Cleanliness Inspection System

Proper Setup of a Basic Stereo Microscope

BX3M Product Overview

Stereo Microscope Ergonomic Video

STM7 Measuring Microscope

EPOCH 650 Product Introduction

27MG Ultrasonic Thickness Gauge Introductory Video

Tech Tours - Olympus Industrial Microscopes

OLYMPUS Stream - Material Solution Modules

OLYMPUS Inspector Series - Product Overview

45MG Product Introduction Video

OLYMPUS Stream - Layer Thickness Solution

OLYMPUS Stream - Inclusion Worst Field Analysis (Non-metallic Inclusions)

GoldXpert - Introducing the GoldXpert

OLYMPUS Stream - 3D Imaging and Measurements

LEXT - Confocal Image Acquisition 2 of 2

LEXT - Confocal Image Acquisition 1 of 2

Overview of the 38DLP/39DLP Ultrasonic Thickness Gauge

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Infographics

Vanta Infographic

SZX Ergonomic Infographic

Rozwiązania

Vanta for Manufacturing QA/QC

DELTA Alloys and Metals Handheld XRF Analyzer

Seminaria internetowe

Webinar - XRF as Part of a Reasonable Testing Program for Consumer Products Regulations

Broszury

Vanta for PMI Brochure

Vanta Specifications

Microscope/Optical Metrology General Overview for Industrial Applications

Remote Visual Inspection Solutions General Overview

MX63/MX63L brochure

LC30 Microscope Digital Camera

Vanta Series Brochure

Motorized Microscope System BX61

Mikroskop systemowy BX53M/BXFM

Phased Array (PA) Probes and Wedges Catalog

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Oficjalne dokumenty

Application Considerations in Specifying High Frequency Ultrasonic Transducers

Roughness Measurement with LEXT, Laser Scanning Microscopes

Basic Principles of Laser Scanning Microscopes

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Poradniki

Ultrasonic Flaw Detection Tutorial

Phased Array Tutorial

Seminarium Eddy Current Array

Ultrasonic Thickness Gauge Tutorial

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Najczęściej zadawane pytania

FAQ - perguntas mais frequentes sobre ensaio por ultrassom

Learn about microscope

Frequently Asked Transducer Questions

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Instrukcje obsługi

Vanta Family X-Ray Fluorescence Analyzer User Interface Guide

Vanta Family X-Ray Fluorescence Analyzer Getting Started Guide

Books

LEXT Roughness measurement guidebook