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Olympus InSight Blog > Measuring Defects

Measuring Defects

Acquiring High-Quality Images Through Silicon Without Damaging the Finished Product

By Robert Bellinger - Setembro 12, 2017

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Autores

Ted Shields

Portable Products Manager, Analytical Instruments

Olympus InSight Team

Olympus NDT - Applications Team

Michelle Wright

Marketing Specialist, Analytical Instruments

Hamish Rossell

Product Applications Manager, Olympus Corporation of the Americas, Scientific Solutions Group

Karen Paklin

Applications Scientist

Sam Habib

Vertical Market Leader, Natural Resources

Peter Faulkner

Frank Lafleur

Product Manager, RVI

Alex Thurston

Applications Engineering Manager

Marc Silverstein

Product Manager, Industrial Microscopes

Damien Blondel (Olympus OISE)

Environmental and Natural Resources Vertical Market Specialist

Francesco Piscani

Applications Specialist

Jose Brum

XRD Scientist

Aaron Baensch

Principal Geologist, Olympus International Mining Group

Robert Bellinger

Product Applications Manager, Industrial Microscopes

Calvin Jory

Product Marketing Specialist, Ultrasonic Flaw Detectors

Joel Drapeau

Jennifer Caban

Sales Engineer

Ghislain Morais

Product Leader, Eddy Current Product Line

Florin Turcu

Application Specialist

Marcus Lake

Global Business Development Manager, International Mining Group

Tommy Bourgelas

Product Manager, Eddy Current and Bond Testing product line

Dillon McDowell

Applications Scientist, Analytical Instruments

Xin Yang

Associate Product Manager

Olympus RVI Applications Team

Jennifer Wrigley

Senior Product Manager, Scientific Solutions Group

Michael W. Hull

Applications Scientist

Charles Janecka

Sales Engineer, Remote Visual Inspection

Simon Alain

Product Manager, Scanners and Inspection Solutions

Dianne Hillhouse

Business Development Manager, Inspection Services Market

Todd Houlahan

Director, International Mining Group

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Acquiring High-Quality Images Through Silicon Without Damaging the Finished Product

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