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Measuring Defects

Acquiring High-Quality Images Through Silicon Without Damaging the Finished Product

By Robert Bellinger - Сентябрь 12, 2017

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Авторы

Portable Products Manager, Analytical Instruments

Olympus InSight Team

Olympus NDT - Applications Team

Michelle Wright

Marketing Specialist, Analytical Instruments

Product Applications Manager, Olympus Corporation of the Americas, Scientific Solutions Group

Applications Scientist

Vertical Market Leader, Natural Resources

Product Manager, RVI

Applications Engineering Manager

Marc Silverstein

Product Manager, Industrial Microscopes

Damien Blondel (Olympus OISE)

Environmental and Natural Resources Vertical Market Specialist

Francesco Piscani

Applications Specialist

XRD Scientist

Principal Geologist, Olympus International Mining Group

Robert Bellinger

Product Applications Manager, Industrial Microscopes

Product Marketing Specialist, Ultrasonic Flaw Detectors

Sales Engineer

Ghislain Morais

Product Leader, Eddy Current Product Line

Application Specialist

Global Business Development Manager, International Mining Group

Tommy Bourgelas

Product Manager, Eddy Current and Bond Testing product line

Dillon McDowell

Applications Scientist, Analytical Instruments

Associate Product Manager

Olympus RVI Applications Team

Jennifer Wrigley

Senior Product Manager, Scientific Solutions Group

Michael W. Hull

Applications Scientist

Charles Janecka

Sales Engineer, Remote Visual Inspection

Product Manager, Scanners and Inspection Solutions

Dianne Hillhouse

Business Development Manager, Inspection Services Market

Director, International Mining Group

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